Mich., Oct. 6, 2026 /PRNewswire/ — FANUC America, a global industrial automation leader, will demonstrate how artificial intelligence, collaborative robotics and machine vision are helping packaging and processing companies tackle labor shortages, simplify product handling and automate more of the packaging process at PACK EXPO International 2026 in Chicago
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion planned for fiscal 2027…
Palladyne AIand FANUC America have announced a strategic collaboration aimed at advancing the next generation of intelligent robotic automation. The partnership combines FANUC’s extensive industrial robot portfolio with Palladyne IQ, the company’s physical AI software platform, to develop more adaptable robotic systems for manufacturing, warehousing, and logistics environments.
